Descripción

PL3307C

Ball Grid Array option

The Ball Grid Array is a chip soldered onto your circuit board. You can embed our data capture technology into your products.
  • Dimensions: 0.472 in. H x 0.748 in. W x 0.094 in. D, (12.00mm H x 19.00mm W x 2.40mm D)
  • Weight: 0.03 oz., (0.9 g)
  • Interface: 104-ball BGA component
  • Scanning Technology: Array
  • Decode Capabilities: 1D and 2D
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